110-41-318-41-001000

CONN IC DIP SOCKET 18POS GOLD | Mill-Max Manufacturing Corp.

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Genel Bakış

Dokümanlar

18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Type: DIP, 0.3" (7.62mm) Row Spacing
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Mounting Type: Through Hole
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Finish - Post: Tin
Operating Temperature: -55°C ~ 125°C
Contact Finish - Mating: Gold
Contact Material - Post: Brass Alloy
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Number of Positions or Pins (Grid): 18 (2 x 9)