2485267-2

DIP IC SOCKET 8P,GOLD FLASH-SMD | TE Connectivity AMP Connectors

DIP IC SOCKET 8P,GOLD FLASH-SMD

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Genel Bakış

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Ürün Açıklaması

8 Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Özellikler

Type: DIP, 0.3" (7.62mm) Row Spacing
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Mounting Type: Through Hole
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Thermoplastic
Contact Finish - Post: Tin
Operating Temperature: -55°C ~ 125°C
Contact Finish - Mating: Gold
Contact Material - Post: Copper Alloy
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Post: 78.7µin (2.00µm)
Contact Finish Thickness - Mating: Flash
Number of Positions or Pins (Grid): 8

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