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Connectors, Interconnects
Contacts
Contacts, Spring Loaded (Pogo Pins), and Pressure
POGOPIN, SOLID NEEDLE, 1.55MM HE

CPG-05-N-B

POGOPIN, SOLID NEEDLE, 1.55MM HE | Same Sky (Formerly CUI Devices)
POGOPIN, SOLID NEEDLE, 1.55MM HE
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Genel Bakış
Dokümanlar

Ürün Açıklaması

Contact Spring Surface Mount

Özellikler

  • Features: -
  • Contact Type: Contact Pad
  • Plunger Size: -
  • Mating Cycles: -
  • Mounting Type: Surface Mount
  • Contact Finish: Gold
  • Contact Material: Brass Alloy
  • Pad Layout Dimension: Circular - 0.059" (1.50mm) Dia, 0.061" (1.55mm) H
  • Maximum Working Height: -
  • Minimum Working Height: -
  • Contact Finish Thickness: 20.0µin (0.51µm)
  • Operating Force - Initial: -
  • Recommended Working Height: -
  • Operating Force - Mid Compression: -
https://www.cuidevices.com/product/resource/pdf/cpg-05-n-b.pdf